VDI/VDE manual Micro and Precision Engineering

VDI Standardisation Work - Principles and procedures

Development of mechatronic and cyber-physical systems

Bolted joints - Tensioned joints - Precision engineering components

Spring, wedge, and force joints - Tensioned joints - Precision engineering components

Precision engineering components - Solder connections

Precision engineering components - Adhesive connections

Precision engineering components; guides; gas-, magnetic- and hydraulic bearings

Plastic and rubber springs - Energy storage components - Precision engineering components

Recycling of electrical and electronic products - Principles and terminology

Recycling of electrical and electronic equipment - Fundamentals, terms, and definitions

Recycling of electrical and electronical equipment - Logistics

Recycling of electrical and electronical equipment - Disassembly

Recycling of electrical and electronic equipment - Preparation techniques

Recycling of electrical and electronic equipment - Material and thermal recycling and removal

Recycling of electrical and electronic equipment - Marketing

Recycling of electrical and electronical equipment - Re-use

Industrial design for products of precision engineering

Gear wheels made from thermoplastics

Requirements on the surface structure to cover function capability of surfaces manufactured by cutting - List of parameters

Accuracy of coordinate measuring machines; characteristic parameters and their checking - Coordinate measuring machines with optical probes - Basics

Optical form measurement - System requirements - Standard form

Tranducers and measuring systems for measurement of angle - Instructions for traceable calibration - Indirect measure angle measuring systems

Experimental stress analysis - Optical strain sensor based in fibre bragg grating - Fundamentals, characteristics and sensor testing

Production of circuit boards; survey and list of procedures

Production of circuit boards; mechanical treatment

Produktion of circuit boards; chemical and galvanic treatment

Production of circuit boards; printing procedures

Production of circuit boards; other procedures

Production of circuit boards; control and testing procedures

Manufacturing of mechatronic integrated devices (MID)

Manufacturing of mechatronic integrated devices (MID) - Laser direct structuring

Test guideline and test workpiece for the water jet cutting technology - Water jet cutting - Test workpiece for 3D processing

Test guideline and test workpiece for the water jet cutting technology - Water jet cutting - Test workpiece for micro water jet cutting

Testing guidelines and testing workpieces for high speed cutting (HSC) - Milling machines and machining centres for 3-axis machining

Project engineer in projects with external team members - Knowledge profile

Project engineer in projects with external team members - Requirements for qualification